Bench PRC 9.6 User Manual download pdf (Page 8)

M O R E T H A N 5 0 Y E A R S O F I N D U S T R Y L E A D E R S H I P

S O L U T I O N S F O R T H E E L E C T R O N I C S I N T E R C O N N E C T I O N P R O C E S S

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SENSATEMP REWORK SYSTEMS

ST 25, MBT 250 & PRC 2000

LEAD FREE SOLDERING

WORKING WITH LEAD FREE SOLDERS

Lead Free solders do not behave or look like their lead containing counterparts. As our industry changes over to Lead Free solders,

individual PCB assemblers will need to address several issues relating to hand soldering and rework. These issues include:

• Higher melting temperatures – which mistakenly lead to operators increasing equipment operating temperatures. Higher

operating temperatures do not make the process quicker, they can actually slow it down.

• Poor wetting and spreading properties – Additional time is required when working with lead free solders, they do not

spread or wet like lead containing solders do. Operators must slow down.

• Difficult to work with - Bridging and insufficient solder defects are common, even for experienced operators, leading to

operator frustration and poor quality.

• Dull grainy finish – makes inspection difficult.

The PRC 2000 Benchtop Factory is the ultimate rework

center. The PRC 2000 can tackle just about any Thru-Hole,

SMT application and is well suited for multilayer repairs on

damaged or prototype PCBs. Featuring 3 simultaneously active

SPECIFICATIONS ST 25 MBT 250 SD/MBT 250 SDTP PRC 2000 SMT PRC 2000 TH

System 115 V 8007-0528

8007-0203 (SD)

8007-0206 (SDTP)

8007-0132 8007-0138

Power Source Only 115 V 8007-0529 8007-0349 N/A N/A

System 230 V 8007-0510

8007-0204 (SD)

8007-0207 (SDTP)

8007-0133 N/A

Power Source Only 230 V 8007-0511 8007-0353 N/A N/A

Input Power Requirements 97-127 VAC, 50/60 Hz or 197-253 VAC, 50/60 Hz

Max Power Consumption 120 W 240 W 400 W

Dimensions

104mm H x 130mm W x

152mm D

(4.1" H x 5.1" W x 6.0" D)

135mm H x 165mm

W x 260mm D

(5.3" H x 6.5” W x 9.25" D)

175mm H x 350mm W x 230mm D

(6.9" H x 13.75” W x 9.25" D)

Weight 2.3 Kgs (5 lbs.) 5 Kgs (11 lbs.) 13 Kgs (28.6 lbs.)

Control LED Display LED Display

Control Technology SensaTemp (Black Connector HandPieces)

Tip to Ground Resistance 2 ohms or less

Temperature Accuracy Meets or exceeds ANSI-J-STD 001

Absolute Temperature Stability ± 1.1°C (± 2 °F) at idle tip temp.

Temperature Range 176° to 482°C (350° to 900°F) nominal

System Can be Calibrated Calibration not required

Pump Type N/A Self Contained Pump

Vacuum Rise Time N/A 150 ms Average

Vacuum (Nominal) N/A 20 in Hg max

Flow Control Valve N/A High Resolution Needle Valve Coarse adjustment

Pressure (Nominal) N/A 18 p.s.i. max 7 p.s.i. max

Air Flow (Nominal) N/A 8 slpm max 13 slpm max

Because Lead Free solders oxidize quickly, more aggressive

and longer lasting fluxes are required to keep surfaces clean

and free from oxidation. Working with no-clean fluxes is

challenging as their process window is often small. Once they

are burned off, oxidation immediately begins to form which

can result in a marginal or defective solder joint. Additionally,

increasing operating temperatures creates an ideal environment

for oxidation to form and will also lead to flux and solder ball

splatter on the PCB. If the flux is splattered all over the PCB, it’s

not able to do its job on the surfaces to be joined during the

soldering process.

Lead Free solders also affect soldering and rework tools and their

effect is detrimental. Lead Free solders contain high percentages

of tin, almost always over 94%. Tin is a corrosive and active

metal. When it mixes with iron (the protective layer on soldering

tips), an inter-metallic compound is formed that wears away

more quickly than the iron would either by itself or when used

with lead containing solder. This causes two problems, one is

shorter tip life as the protective iron coating is dissolved in the

tin, and the second is that oxidation forms more quickly which is

further exacerbated by the high temperature environment the tips

work in. As a result, tin oxides form and create an inter-metallic

compound with the iron plating on the tip. Once the oxidation

begins to form, the tip will lose its ability to wet with solder and if

not cleaned off quickly, it becomes almost impossible to remove

and the tip must be replaced.

When using Lead Free solders, regardless of alloy, it is absolutely

imperative that tips are properly maintained, otherwise tip life

will be reduced significantly. Tips should be cleaned frequently

to remove oxidation before it becomes impossible to remove.

Tips should always be tinned when not being used, otherwise

oxidation will quickly form on the tip. If the iron will not be used

for extended periods of time, they should be turned off. Should

oxidation form that cannot be easily cleaned by tinning or by

using a cleaning tool, PACE’s Tip-Brite is recommended.

Tip-Brite is a high quality tip tinner that will remove stubborn

oxidation.

The use of equipment with SetBack and Auto-Off functions

(standard on all PACE equipment), is very desirable. Additionally,

optional accessories such as PACE’s Instant SetBack Cubby

ensure that tip life is maximized. The Instant SetBack Cubby puts

the system into “SetBack” after 45 seconds of inactivity. When

the iron is removed from the cubby, it restores itself to the set

temperature almost immediately.

The use of nitrogen assisted soldering equipment helps to

mitigate the problems associated with using Lead Free solders.

Nitrogen helps on two fronts. First, it creates an inert environment

around the soldering tip, reducing the potential for tip to oxidize.

Second, it assists in the soldering process at the PCB level by

purging oxygen from the immediate area which reduces or

eliminates the formation of oxidation on the work site. This not

only reduces the amount of flux that is required, but it also helps

to improve wetting, spreading and leaves a finish that is shinier

and less grainy.

PACE’s nitrogen assisted soldering systems pass the nitrogen

through or around the heater before it is directed to the work

site. This “pre-heats” the immediate area which can also help

to reduce thermal shock to component leads and to components

themselves. Pre-heating also allows for the use of lower, safer

and more effective soldering temperatures.

PACE’s soldering systems offer legendary thermal control as well

as advanced features to maintain your process. Unique PACE

features such as IntelliHeat, Power Modules and password

protection ensure consistency and quality in your process.

Economical tips and standard features such as “SetBack” and

“Auto-Off” maximize tip life to reduce operating costs and

increase your bottom line.

SensaTemp handpiece channels, a built-in paste dispenser, MicroChine for removing conformal coatings or grinding away PCB

laminate, and pulse heat technology. The PRC 2000 comes with 9 handpieces and continuously calibrates automatically.

The ST 25 soldering system uses SensaTemp to maximize heat delivery and improves quality, reduces costs and eliminates the

maintenance and calibration hassles associated with other soldering systems. The heavy-duty metal housing makes this system the ideal

choice for the harshest environments and the sloped face of the front panel is a standard feature for ease of use. An optional mounting

bracket (P/N 1321-0609-P1) is available to mount the system under a work-bench or shelf, preserving precious bench top space.

FEATURES:

• SensaTemp Control Technology

• Analog (dial) control

•

F Temperature Scales

• Temperature Adjustment Lockout

• ESD grounding jack

• ESD Safe metal housing

• Stackable

• Can be mounted under work

bench or shelf with optional bracket 1321-0609-P1

MBT 250

SD/SDTP

Still Available

SENSATEMP POWER SOURCE SPECIFICATIONS

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Bench PRC 9.6 User Manual Page 8

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